The X-ray image of a dual in-line package (DIP) chip reveals the overall structure clearly: the darkest parts on the top and bottom rows represent the external pins of the chip, while the square with black dots in the center depicts the chip and its die, surrounded by radial fine wires which are the bonding…
SMT production line equipment is highly precise mechanical automation machinery. Both the equipment and process materials have certain requirements for the cleanliness, humidity, and temperature of the environment. In order to ensure the normal operation of the machinery and the quality of assembly, the following requirements are imposed on the working environment in the SMT…
With the rapid development of industry and the increase in production costs, improving production efficiency has become imperative. Printing is the first step in making a good product, making the introduction of automatic soldering devices a trend. Below is a brief explanation of the principle and application of automatic soldering devices. Principle: The system consists…
The working principle of BGA rework stations varies slightly among different manufacturers, but they generally share similar concepts. Let’s first introduce the concept of temperature profiles. The solder balls on BGAs are divided into two types: leaded and lead-free. Leaded solder balls have a melting point between 183°C and 220°C, while lead-free solder balls have…
Initially, when manually desoldering BGA ICs, many of us may feel apprehensive because we lack an understanding of its soldering process and precautions. Each person may have their own approach to manually desoldering BGAs, but overall, it is important to adhere to scientific soldering standards. Understanding the principles and processes of surface mount soldering for…
As society progresses, it seems that we can’t live without our mobile phones. Therefore, mobile phone repair has become a significant issue, and many factories or repair shops are unsure how to choose a suitable mobile BGA rework station. Indeed, as a high-priced and long-term device, encountering problems with a mobile BGA rework station several…
There are generally two methods for reworking BGA chips: BGA rework stations and manual rework with hot air guns. Most factories or repair shops choose BGA rework stations because of their high success rate and simple operation, requiring minimal skills from operators and featuring one-click operation, suitable for batch rework. The second method, manual rework,…
BGA chips share a common characteristic: they are small in size, powerful in function, low in cost, and high in performance. Therefore, BGA chips are widely used in many applications. The equipment used for reworking BGA chips is called a BGA rework station or BGA rework system, which covers various types of packaged chips. So,…
Auxiliary materials for BGA rework stations are essential for repairing BGA chips. During the soldering process, we inevitably need to handle tasks such as ball planting. Below are several commonly used consumable tools: Flux paste plays a significant role in the soldering process. Whether it’s re-soldering or direct soldering, we need to apply flux paste…
For the majority of small and medium-sized contract manufacturers or production plants, cost considerations often lead them to use traditional manual brushing cleaning methods. This involves using an antistatic brush dipped in cleaning agent to brush the PCB. The PCB is tilted at a 45° angle, and the brush is moved from top to bottom,…
