Optical Alignment System: Utilizes high-definition CCD high-precision optical alignment system to ensure accurate component placement; the optical alignment device automatically enters and exits, equipped with fixed-point observation function for quick observation of chip corner and center alignment status. Operation and Control System: Features automatic soldering, desoldering, mounting, and feeding operations with one-touch operation for simplicity…

The working principle of BGA rework stations varies slightly among different manufacturers, but they generally share similar concepts. Let’s first introduce the concept of temperature profiles. The solder balls on BGAs are divided into two types: leaded and lead-free. Leaded solder balls have a melting point between 183°C and 220°C, while lead-free solder balls have…

Initially, when manually desoldering BGA ICs, many of us may feel apprehensive because we lack an understanding of its soldering process and precautions. Each person may have their own approach to manually desoldering BGAs, but overall, it is important to adhere to scientific soldering standards. Understanding the principles and processes of surface mount soldering for…

As society progresses, it seems that we can’t live without our mobile phones. Therefore, mobile phone repair has become a significant issue, and many factories or repair shops are unsure how to choose a suitable mobile BGA rework station. Indeed, as a high-priced and long-term device, encountering problems with a mobile BGA rework station several…

There are generally two methods for reworking BGA chips: BGA rework stations and manual rework with hot air guns. Most factories or repair shops choose BGA rework stations because of their high success rate and simple operation, requiring minimal skills from operators and featuring one-click operation, suitable for batch rework. The second method, manual rework,…