BGA (Ball Grid Array) utilizes solder balls on the entire bottom to connect with the circuit board, greatly increasing the equipment’s I/O count, shortening signal transmission paths, and exhibiting excellent heat dissipation performance. Due to its short leads, BGA has low inductance and mutual inductance between wires, resulting in good frequency characteristics. During reflow soldering, the wettability between the molten solder balls and solder paste produces outstanding self-alignment effects, allowing for a margin of error of up to 1/3 in placement.
Although the solder joints of BGA are hidden under the package, which can save a lot of space, the pins are densely packed, making direct visual inspection impossible. Additionally, the contact points are prone to aging, and the solder joint area is small, making it unable to withstand mechanical stress.
- Baking
It is essential to determine whether BGA components need to be baked based on the packaging instructions. BGA components that have been stored in the air for an extended period may require moderate baking to ensure soldering quality.
- Mounting
Components such as resistors, capacitors, and SOIC can be mounted using manual surface mounting processes, while BGA requires specialized equipment to complete its mounting process.
- Stenciling
Components like resistors, capacitors, and SOIC can undergo solder paste application through manual stenciling processes, whereas BGA components require dedicated templates for solder paste printing.
- Soldering
BGA components cannot be soldered manually and can only be soldered using specialized equipment such as reflow soldering ovens, BGA machine, etc.
- Inspection
After BGA installation, visual inspection is not feasible, and X-ray inspection equipment needs to be used to inspect for bridging, voids, solder balls, and other soldering defects.