Many people may not be clear about this. In fact, for server motherboard rework, using a Silman Tech BGA rework station is sufficient.
Server motherboard rework is essentially the same, so the Silman Tech BGA rework station DEZ-R880A can be used for rework. As a professional server motherboard manufacturer, Intel will undoubtedly have a set of professional rework equipment for reworking BGA chips. With the development of technology, the spacing between BGA chips on server motherboards has become smaller. Generally, reworking BGA chips with larger spacing is relatively simple and can be done using ordinary equipment. However, if the spacing is less than 4mm, a professional BGA chip rework station must be used.
The Silman Tech BGA rework station DEZ-R880A features an independently controlled three-part heating system that can be flexibly combined to easily solve the temperature difference requirements for reworking closely spaced adjacent BGA chips (the temperature of another BGA solder ball adjacent to a 4mm spaced BGA chip must be below 183°C).
The Silman Tech BGA rework station DEZ-R880A is mainly designed for server motherboards, PC motherboards, tablets, smart terminals, and other PCBA boards. With its independently controlled three-part heating system design, integrated BGA component removal, mounting, alignment selection, automatic generation of rework temperature curves, multiple machine safety protection functions, and a fine, flexible, and user-friendly PCB placement table.
The above information covers all aspects of reworking BGA chips on server motherboards. With the changing times, the electronic components of server motherboards are becoming more refined, which is a development trend. Not all BGA chip rework equipment can handle such fine electronic components, but Silman Tech provides you with such rework equipment.