As everyone knows, smartphones apply glue to the chips to prevent rework. However, there are still many repair technicians who see significant business opportunities here, especially in countries where electronics work is rampant. By using technical methods to repair BGA chips in smartphones and then reusing them, considerable profits can be gained. Therefore, although it…
If a chip on your server motherboard is damaged, simply scrapping it would increase costs significantly. It’s worth noting that server motherboards vary greatly in price among different brands, depending on the functions of the chips. Some server motherboard chips can cost from thousands to hundreds of thousands. Using a machine to remove and re-solder…
What BGA rework station is good? Over the years, the BGA rework industry has quietly developed for decades, from initial unfamiliarity and lack of understanding to gradually replacing traditional manual soldering processes. Domestic BGA rework station companies have seen rapid development in the market, with brands and models of BGA rework stations becoming increasingly diverse.…
As product integration and precision continue to increase, the application of BGA chips is becoming more widespread. A BGA rework station is essential for ensuring the success rate of BGA chip repairs. How to choose a suitable rework device is particularly important. Today, I’ll share several practical tips to help you make a better choice.…
Usually, the rework curve can be divided into five stages: preheating, ramp-up, soak, reflow, and cool down. Below is an explanation of how to adjust when the curve is found to be inadequate, typically divided into three parts. Adjustment for Shortened Preheating Time: Adjustment for Shortened Cool Down Time:
The formation of BGA solder voids can lead to current concentration effects and reduce the mechanical strength of solder joints. Therefore, from a reliability perspective, it is necessary to reduce or minimize solder voids. To answer this question, it is necessary to explore the causes of void formation. There are various reasons for the formation…
BGA (Ball Grid Array) utilizes solder balls on the entire bottom to connect with the circuit board, greatly increasing the equipment’s I/O count, shortening signal transmission paths, and exhibiting excellent heat dissipation performance. Due to its short leads, BGA has low inductance and mutual inductance between wires, resulting in good frequency characteristics. During reflow soldering,…
Many users may have a doubt when they first encounter BGA rework stations: what are the differences between a conventional BGA rework station and a high-precision optical BGA rework station? Let’s start with two concepts from Baidu. Optical alignment—utilizing an optical module with a prism imaging method, LED lighting, adjusting the light field distribution to…
يمكن تقسيم تقنية التعبئة والتغليف BGA إلى خمس فئات بالتفصيل: 1. ركيزة PBGA (Plasric BGA): بشكل عام عبارة عن لوح متعدد الطبقات يتكون من 2-4 طبقات من المواد العضوية. في معالجات سلسلة Intel CPU، Pentium II، III، IV جميعها تعتمد هذا النوع من أشكال التغليف. 2. الركيزة CBGA (CeramicBGA): الركيزة الخزفية، والاتصال الكهربائي بين ...
1. لوح زراعة القصدير تنقسم ألواح زراعة القصدير التجارية تقريبًا إلى فئتين: الأولى هي صنع جميع النماذج على لوح زراعة قصدير كبير ملتصق؛ والآخر هو أن يكون هناك لوح واحد لكل نوع من أنواع IC، وتختلف طريقة استخدام اللوحة. استخدام…
