BGA encapsulation reballing standard refers to a technique used in semiconductor packaging where chips are attached to a substrate. Due to its advantages such as fewer solder joints, smaller spacing, and higher reliability, BGA packaging finds extensive applications in electronic products. Reballing is a critical step in BGA encapsulation, and adherence to reballing standards is essential to ensure stable reballing quality.
BGA encapsulation reballing standard involves the operation standard of attaching solder balls to chip pins during the BGA encapsulation process. The quality of reballing has a significant impact on the performance and reliability of chips during BGA encapsulation. Therefore, establishing BGA encapsulation reballing standards is of great significance. Depending on the reballing method and materials, BGA encapsulation reballing standards can be categorized into various types.
BGA encapsulation reballing standard parameters refer to the diameter, height, distance, and pressure of reballing during the BGA encapsulation process. The ball diameter refers to the diameter of the reballing needle, directly affecting the accuracy and stability of reballing. Ball height refers to the distance between the chip and the PCB after reballing, which is also a crucial parameter. Ball distance refers to the distance between adjacent solder balls, which needs to be determined based on specific BGA encapsulation requirements. Ball pressure refers to the pressure exerted by the reballing needle on the chip, ensuring the depth and stability of reballing.
