Chips serve as the carriers of integrated circuits, cut from wafers. They are present in various electronic devices such as smartphones, laptops, smart TVs, cars, and central air conditioners. Given the high integration and precision of electronic components, traditional inspection methods often struggle to detect defects effectively. Therefore, X-ray inspection equipment is commonly used for the thorough examination of chips.
The key to using X-ray inspection equipment for chip defect detection lies in the generation of X-rays within the X-ray inspection machine to irradiate the internal structure of the chip. X-rays have strong penetrative capabilities, allowing them to penetrate through the chip and produce images of its internal structure. This method enables the detection of structural fractures in chips without causing any damage, hence it is referred to as non-destructive testing.
Chip X-ray inspection equipment utilizes the principle of X-ray transmission to perform real-time imaging inspection of the structure of the tested object. It is widely used in industries such as rechargeable batteries, Surface Mount Technology (SMT), LED manufacturing, electronic product processing, and casting processing. It effectively analyzes defects in the internal structure of critical components, providing customers with high-quality, high-magnification, and high-resolution images with ease.
