Overview
Semi-automated rework system for normal SMD, BGA, QFP, CSP, sockets, Micro-SMD components etc.
The ST-R720 SMD / BGA Rework Stations feature the latest vision and thermal process control technologies. Printed circuit boards and substrates consisting of components such as BGA’s, CSP’s, QFN’s, Flip Chips, Support P08 Small pitch LED beads, Min. 0.5mm * 0.5mm IC.
- Stable and Uniform Hot Air Heating System
- Lower Heater Adjustable
- Carbon Fiber Micro-crystalline Infrared Preheater
- High-Precision PID Temperature Control System
- High-Precision Optical Alignment System with Industrial High-Definition CCD (2MP)
- High-Resolution Touch Screen HMI Interface
- Automatic Placement, Soldering, Desoldering
- Built-In Pressure Testing Device to Protects the PCB
- Real-time Temperature Monitoring and Over-Temperature Protection.
- Emergency Stop Function
| Total Power | Max 5800W |
|---|---|
| Power | AC 220V±10% 50/60 Hz |
| Top heater power | 1200W |
| Bottom heater power | 1200W |
| IR power | 3200W |
| Hot air temp | 400℃ (Max) |
| Preheating temp | 400℃（Max） |
| Positioning | V-groove +laser positioning+ universal fixture |
| PCB size | Max 415×370 mm Min 6×6 mm |
| Preheating size | 370mm×270mm |
| Chip type | BGA, QGN, CSP, POP, QFN, Micro SMD, LED lamp beads |
| Chip size | Max 60×60mm Min 0.6×0.6 mm |
| Dimensions | L800×W640×H950 mm |
| Temperature sensor | 1Pc |
| Net weight | 83kG |
| Color | White |
- Rework Process Inspection Camera
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