Overview
Semi-automated rework system for normal SMD, BGA, QFP, CSP, sockets, Micro-SMD components etc.
The ST-R6200 SMD / BGA Rework Stations feature the latest vision and thermal process control technologies. Printed circuit boards and substrates consisting of components such as BGA’s, CSP’s, QFN’s, Flip Chips, Support P08 Small pitch LED beads, Min. 2mm * 2mm IC.
- Stable and Uniform Hot Air Heating System
- Lower Heater Adjustable
- Carbon Fiber Infrared Pre-heater
- High-Precision PID Temperature Control System
- Industrial High-Definition CCD Camera(1.3MP)
- High-Precision Optical Alignment System
- High-Resolution Touch Screen HMI Interface
- Automatic Placement, Desoldering
- Built-In Pressure Sensor System To Protects The PCB
- Real-Time Temperature Monitoring and Over-Temperature Protection.
- Emergency Stop Button
| Item | ZM-R6200 |
|---|---|
| Operation Mode | Automatic / Optical /Touch Panel |
| Voltage/Power | AC220V±10%(110V Optional), 50/60HZ / Top: 1200W, Bottom: 1200W, IR: 2700W |
| Heating Mode | Top/Bottom Nozzle Hot Air, Bottom Plates Infrared |
| Temperature Precision | 2~3℃ (1 Sensor Port) |
| Preheat Zone | 280×380mm |
| Optical Alignment Precision | 0.02MM |
| CCD Magnification: | 5X~50X |
| LCD Display | 15〞720P HD LCD Display |
| For PCB Size/Chip Size | PCB Size: 415*370~22*22MM / Chip Size: 2*2MM ~ 50*50MM |
| Machine Dimension | L640*W630*H900 (MM) |
| Net Weight | 70KG |
| Standard Wooden Packing | Packing Size: L750*W700*H950(MM) / G.W: 120KG |
- Rework Process Inspection Camera
