{"id":48225,"date":"2024-04-19T03:05:00","date_gmt":"2024-04-19T03:05:00","guid":{"rendered":"https:\/\/silmantech.com\/?p=48225"},"modified":"2024-04-18T09:17:41","modified_gmt":"2024-04-18T09:17:41","slug":"use-x-ray-to-detect-the-effects-of-different-packaged-chips","status":"publish","type":"post","link":"https:\/\/silmantech.com\/it\/use-x-ray-to-detect-the-effects-of-different-packaged-chips\/","title":{"rendered":"Utilizzare i raggi X per rilevare gli effetti di diversi chip confezionati."},"content":{"rendered":"
    \n
  1. L'immagine a raggi X di un chip dual in-line package (DIP) rivela chiaramente la struttura complessiva: le parti pi\u00f9 scure nelle file superiore e inferiore rappresentano i pin esterni del chip, mentre il quadrato con i punti neri al centro raffigura il chip e il suo die, circondato da fili sottili radiali che...<\/li>\n\n\n\n
  2. In the X-ray image of a dual in-line package (DIP) chip, the wider shadow between the pins and bonding wires indicates the extended portion of the chip pins within the package.<\/li>\n\n\n\n
  3. After removing the packaging of the dual in-line package (DIP) chip, the die is exposed, surrounded by radial golden wires which are pure gold bonding wires connecting the die to the chip pins.<\/li>\n\n\n\n
  4. The X-ray image of a chip.<\/li>\n\n\n\n
  5. Image of the die exposed after removing the packaging of the chip, showing the golden bonding wires.<\/li>\n\n\n\n
  6. X-ray image of a ball grid array (BGA) packaged chip.<\/li>\n\n\n\n
  7. X-ray image of a BGA packaged chip.<\/li>\n\n\n\n
  8. X-ray image of a commonly used SDRAM chip, where the chip pins and bonding wires are clearly visible.<\/li>\n\n\n\n
  9. X-ray image of a 64-pin thin quad flat package (TQFP) packaged chip, with the die, pins, and bonding wires clearly visible.<\/li>\n\n\n\n
  10. Actual view of a 64-pin thin quad flat package (TQFP) packaged chip.<\/li>\n\n\n\n
  11. X-ray image of a gas discharge tube.<\/li>\n\n\n\n
  12. X-ray image of a NAND flash chip packaged in a surface-mount TSOPI-48 package, with the internal structure clearly visible.<\/li>\n\n\n\n
  13. X-ray image of a surface-mount PQFP-128 packaged chip.<\/li>\n\n\n\n
  14. X-ray image of a NAND flash chip packaged in a surface-mount TSOPI-48 package.<\/li>\n\n\n\n
  15. X-ray image of a surface-mount TSSOP-48 packaged chip, showing the chip pins, bonding wires, base holding the die, and die from outside to inside.<\/li>\n\n\n\n
  16. Image of the die under a microscope after removing the packaging of a surface-mount TSSOP-48 packaged chip, with black stripe-like parts around indicating the bonding wires.<\/li>\n\n\n\n
  17. X-ray image of a surface-mount 24-pin wafer-level quad flat package (WQFN) packaged chip.<\/li>\n\n\n\n
  18. Bottom view of the actual surface-mount 24-pin WQFN packaged chip.<\/li>\n<\/ol>","protected":false},"excerpt":{"rendered":"

    L'immagine a raggi X di un chip dual in-line package (DIP) rivela chiaramente la struttura complessiva: le parti pi\u00f9 scure nelle file superiore e inferiore rappresentano i pin esterni del chip, mentre il quadrato con i punti neri al centro raffigura il chip e il suo die, circondato da fili sottili radiali che...<\/p>","protected":false},"author":3,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_stopmodifiedupdate":false,"_modified_date":"","footnotes":""},"categories":[1,92],"tags":[],"class_list":["post-48225","post","type-post","status-publish","format-standard","hentry","category-news","category-x-ray-inspection-system","category-1","category-92","description-off"],"_links":{"self":[{"href":"https:\/\/silmantech.com\/it\/wp-json\/wp\/v2\/posts\/48225","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/silmantech.com\/it\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/silmantech.com\/it\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/silmantech.com\/it\/wp-json\/wp\/v2\/users\/3"}],"replies":[{"embeddable":true,"href":"https:\/\/silmantech.com\/it\/wp-json\/wp\/v2\/comments?post=48225"}],"version-history":[{"count":0,"href":"https:\/\/silmantech.com\/it\/wp-json\/wp\/v2\/posts\/48225\/revisions"}],"wp:attachment":[{"href":"https:\/\/silmantech.com\/it\/wp-json\/wp\/v2\/media?parent=48225"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/silmantech.com\/it\/wp-json\/wp\/v2\/categories?post=48225"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/silmantech.com\/it\/wp-json\/wp\/v2\/tags?post=48225"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}