{"id":47998,"date":"2024-04-20T03:22:00","date_gmt":"2024-04-20T03:22:00","guid":{"rendered":"https:\/\/silmantech.com\/?p=47998"},"modified":"2024-04-18T09:19:24","modified_gmt":"2024-04-18T09:19:24","slug":"root-causes-and-prevention-measures-of-excessive-solder-on-pcb-solder-joints","status":"publish","type":"post","link":"https:\/\/silmantech.com\/it\/root-causes-and-prevention-measures-of-excessive-solder-on-pcb-solder-joints\/","title":{"rendered":"Cause principali e misure di prevenzione dell'eccesso di saldatura sui giunti a saldare dei PCB"},"content":{"rendered":"

Causes of Excessive Solder:<\/p>\n\n\n\n

    \n
  1. Low soldering temperature leading to increased viscosity of the molten solder.<\/li>\n\n\n\n
  2. Low preheating of the PCB, causing heat absorption by components and the PCB, resulting in a decrease in actual soldering temperature.<\/li>\n\n\n\n
  3. Poor activity or insufficient proportion of flux, causing solder to concentrate in one area without spreading.<\/li>\n\n\n\n
  4. Poor solderability of pads, plated through-holes, or pins, preventing sufficient wetting and trapping air bubbles in the solder joint.<\/li>\n\n\n\n
  5. Reduction in the proportion of tin or increase in copper content in the solder alloy, leading to increased viscosity and decreased fluidity of the solder.<\/li>\n\n\n\n
  6. Excessive solder dross leading to solder alloy encapsulating dross residue, which accumulates at the solder joint, causing it to enlarge.<\/li>\n<\/ol>\n\n\n\n

    Improvement Measures for Excessive Solder:<\/p>\n\n\n\n

      \n
    1. Adjusting and selecting appropriate peak soldering temperature and soldering time.<\/li>\n\n\n\n
    2. Setting preheating temperature based on PCB size, number of layers, quantity of components, presence of surface-mounted components, etc.<\/li>\n\n\n\n
    3. Changing flux or adjusting its proportion appropriately.<\/li>\n\n\n\n
    4. Improving the processing quality of PCBs, implementing a first-in-first-out component handling policy, and avoiding storage in humid environments.<\/li>\n\n\n\n
    5. Adjusting the alloy composition of solder.<\/li>\n\n\n\n
    6. Cleaning solder dross at the end of each shift.<\/li>\n<\/ol>","protected":false},"excerpt":{"rendered":"

      Cause dell'eccesso di saldatura: Misure di miglioramento per le saldature eccessive:<\/p>","protected":false},"author":3,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_stopmodifiedupdate":false,"_modified_date":"","footnotes":""},"categories":[1,91],"tags":[],"class_list":["post-47998","post","type-post","status-publish","format-standard","hentry","category-news","category-selective-wave-soldering-machine","category-1","category-91","description-off"],"_links":{"self":[{"href":"https:\/\/silmantech.com\/it\/wp-json\/wp\/v2\/posts\/47998","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/silmantech.com\/it\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/silmantech.com\/it\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/silmantech.com\/it\/wp-json\/wp\/v2\/users\/3"}],"replies":[{"embeddable":true,"href":"https:\/\/silmantech.com\/it\/wp-json\/wp\/v2\/comments?post=47998"}],"version-history":[{"count":0,"href":"https:\/\/silmantech.com\/it\/wp-json\/wp\/v2\/posts\/47998\/revisions"}],"wp:attachment":[{"href":"https:\/\/silmantech.com\/it\/wp-json\/wp\/v2\/media?parent=47998"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/silmantech.com\/it\/wp-json\/wp\/v2\/categories?post=47998"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/silmantech.com\/it\/wp-json\/wp\/v2\/tags?post=47998"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}