- Reducing ICT/AXI Overlaps: Utilizing a combination of two or more technologies in oven fixtures is becoming a trend. By reducing unnecessary test coverage for ICT/AXI, the number of ICT contact points can be significantly reduced. This simplified ICT oven fixture testing requires only 30% of the original test coverage to maintain high test coverage. Moreover, reducing the number of ICT test points can shorten ICT testing time, expedite ICT programming, and lower ICT fixture and programming costs.
- AwareTest Technology: ICT can affect the orientation and nominal values of components but cannot determine whether solder joints are acceptable, especially for components with bottom-mounted solder joints such as BGAs and CSPs. With the advancement of AXI technology, current AXI systems and ICT systems can “communicate” with each other. This technology, known as “AwareTest,” eliminates redundant testing between the two systems.
- Compensating for Each Other’s Deficiencies: Each technology compensates for the deficiencies of the other. Combining AXI technology with ICT oven fixture technology allows for comprehensive testing. X-ray technology primarily focuses on the quality of solder joints. It can confirm the existence of components but cannot verify their correctness, orientation, or nominal values.
In summary, combining oven fixtures with test strategies involves optimizing ICT and AXI testing processes to ensure efficient and comprehensive testing of PCB assemblies.
