BGA, or Ball Grid Array, is a type of chip soldered onto a circuit board and represents a modern packaging method. There are primarily two methods for soldering BGA chips: one involves using an automatic BGA rework station, while the other relies on manual soldering of BGA chips. Let’s briefly introduce both methods. (1) Prepare…

To solder and remove BGAs (Ball Grid Array) chips, it’s best to use a dedicated BGA rework station. However, if you don’t have access to one for small-scale rework, you can also use tools like a hot air gun or an electric soldering iron, although the efficiency of soldering using these tools is relatively low…

Optical Alignment System: Utilizes high-definition CCD high-precision optical alignment system to ensure accurate component placement; the optical alignment device automatically enters and exits, equipped with fixed-point observation function for quick observation of chip corner and center alignment status. Operation and Control System: Features automatic soldering, desoldering, mounting, and feeding operations with one-touch operation for simplicity…

The working principle of BGA rework stations varies slightly among different manufacturers, but they generally share similar concepts. Let’s first introduce the concept of temperature profiles. The solder balls on BGAs are divided into two types: leaded and lead-free. Leaded solder balls have a melting point between 183°C and 220°C, while lead-free solder balls have…

Initially, when manually desoldering BGA ICs, many of us may feel apprehensive because we lack an understanding of its soldering process and precautions. Each person may have their own approach to manually desoldering BGAs, but overall, it is important to adhere to scientific soldering standards. Understanding the principles and processes of surface mount soldering for…