BGA rework station is a type of equipment that effectively improves assembly yield and significantly increases usage frequency. It can perform assembly-compatible co-planar soldering, exhibiting high reliability, and is favored by many customers. Below is a classification introduction of BGA rework stations, hoping to be helpful to everyone. The manual model is suitable for BGA…

Why BGA Reballing is Necessary: The purpose of BGA reballing is to facilitate the soldering of BGA chips. With the increasing application of BGA technology, issues such as BGA chip reflow may arise. Typically, when there are soldering issues under the chip, such as with Northbridge or contact points, BGA equipment can be used for…

The price of a BGA reballing machine varies depending on user requirements for chip rework. The rework process typically includes removal, desoldering, reballing, and soldering, with the BGA reballing machine used specifically during the reballing phase, an essential part of the chip rework workflow. So, how much does a BGA reballing machine cost? The price…

With the changing times, BGAs (Ball Grid Arrays) have become widely used. In this context, it’s essential to understand the various types of reballing processes, such as Koses reballing and IC chip reballing. Regardless of the method used for reballing, a BGA reballing machine is necessary. In the reballing process, a reballing stencil is also…

BGA encapsulation reballing standard refers to a technique used in semiconductor packaging where chips are attached to a substrate. Due to its advantages such as fewer solder joints, smaller spacing, and higher reliability, BGA packaging finds extensive applications in electronic products. Reballing is a critical step in BGA encapsulation, and adherence to reballing standards is…