The range of BGA rework stations includes various packaged chips for BGA chip repair. BGA (Ball Grid Array) technology enhances the functionality of digital electronic products and reduces product size through a grid array structure. Digital electronic products encapsulated through BGA technology share common characteristics of small size, strong functionality, low cost, and practicality. A BGA rework station is used for repairing BGA chips. When a chip is detected with a problem that requires maintenance, a BGA rework station is used for the repair process. This is the function of a BGA rework station. Additionally, the operation is simple. Selecting a BGA rework station for repairing BGAs can quickly elevate your BGA rework skills. It’s as simple as heating from the top and bottom with a hot air gun: heating is accomplished by hot air, and the airflow is controlled using a nozzle. This concentrates the heat on the BGA to prevent damage to surrounding components.
Using a BGA rework station minimizes damage to BGA chips and PCB boards. It is well understood that high-temperature heating is required during BGA rework. At this point, the temperature control accuracy is very high, and even slight deviations can lead to damage to BGA chips and PCB boards. The temperature control accuracy of a BGA rework station can be as precise as within 2 degrees Celsius. This ensures that the BGA chip remains intact during the rework process, which cannot be achieved by a hot air soldering iron. The core of successful BGA rework ultimately revolves around temperature and board deformation issues, which are crucial technical challenges. To some extent, the machine equipment prevents human factors from affecting the success rate of rework, thereby increasing and maintaining stable success rates.
A BGA rework station can also prevent solder from flowing to other pads, achieving uniform solder ball sizes. After washing the BGA, it can be aligned and mounted on the PCB, and then reflowed to complete the component rework. It is important to note that using manual methods to wash solder pads may not completely and thoroughly remove impurities in a timely manner. Therefore, it is recommended to choose a fully automatic BGA rework station when selecting a BGA rework station, as it can save you time, labor costs, and money. While the price of a fully automatic BGA rework station may be relatively high, its rework efficiency and functionality are incomparable to manual BGA rework stations. Therefore, it is essential to conduct evaluation, comparison, and analysis before purchasing.
The above is all the content about the functions of a BGA rework station introduced by the editor. In fact, a BGA rework station cannot fix everything. It is mainly suitable for reworking various surface-mount devices (SMDs) such as BGA, QFN, PGA, POP, PLCC, TQFP, TSOP, etc. If you want to learn more about the functions of BGA rework stations or want to purchase a high-yield BGA rework station, you can learn about Silman Tech’s fully automatic BGA rework station.
