The manufacturing process of wafers involves various intricate procedures and chemical materials. Residues of chemical substances, particles, and metal materials are commonly found on the surface of wafers after different processing steps. If not cleaned promptly, these residues can accumulate over time, affecting the final product quality. Therefore, the cleaning equipment has become a crucial aspect of process development in the wafer manufacturing process.
With the continuous advancement of integrated circuit technology, the number and frequency of using cleaning equipment have increased significantly. The cleaning process rate directly impacts the yield of wafer manufacturing, constituting approximately 33% of the entire production process. Consequently, cleaning equipment has become an essential component in wafer processing.
There are two main types of cleaning equipment based on the cleaning method: single wafer and batch-type. Single wafer cleaning machines consist of several cleaning chambers, where each wafer is individually subjected to spray cleaning. This method ensures excellent cleaning results and minimizes cross-contamination between wafers. However, it has the drawback of lower cleaning throughput and higher costs. Batch-type cleaning machines involve placing wafers in baskets and subjecting them to cleaning in bulk. Although this method offers higher cleaning throughput and lower costs, it may result in cross-contamination between wafers. Batch-type cleaning machines typically consist of corrosion-resistant racks, acid tanks, water tanks, drying tanks, control units, exhaust units, and gas and liquid pipeline units.
In the past 30 years, the chemical components used in wafer cleaning have remained largely unchanged, primarily relying on the RCA cleaning process involving acidic hydrogen peroxide and ammonium hydroxide solutions. However, recent advancements in cleaning technology have introduced new cleaning processes, including ozone cleaning and megasonic cleaning systems. These new processes have been adopted by many wafer fabs to optimize cleaning efficiency.
In summary, while single wafer cleaning remains essential, batch-type cleaning equipment continues to dominate the wafer cleaning landscape due to its cost-effectiveness and efficiency. For inquiries about wafer cleaning equipment, feel free to consult Silman Tech’s online customer service representatives.
